MU 10-K Annual Report Aug. 31, 2017 | Alphaminr
MICRON TECHNOLOGY INC
ALPHAMINR

MU 10-K Fiscal year ended Aug. 31, 2017

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MICRON TECHNOLOGY INC
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PROXIES
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TABLE OF CONTENTS
Part IItem 1. BusinessItem 1A. Risk FactorsItem 1B. Unresolved Staff CommentsItem 2. PropertiesItem 3. Legal ProceedingsItem 4. Mine Safety DisclosuresPart IIItem 5. Market For Registrant's Common Equity, Related Stockholder Matters and Issuer Purchases Of Equity SecuritiesItem 6. Selected Financial DataItem 7. Management's Discussion and Analysis Of Financial Condition and Results Of OperationsItem 7A. Quantitative and Qualitative Disclosures About Market RiskItem 8. Financial Statements and Supplementary DataItem 9. Changes in and Disagreements with Accountants on Accounting and Financial DisclosureItem 9A. Controls and ProceduresItem 9B. Other InformationPart IIIItem 10. Directors, Executive Officers and Corporate GovernanceItem 11. Executive CompensationItem 12. Security Ownership Of Certain Beneficial Owners and Management and Related Stockholder MattersItem 13. Certain Relationships and Related Transactions, and Director IndependenceItem 14. Principal Accountant Fees and ServicesPart IVItem 15. Exhibits, Financial Statement SchedulesItem 16. 10-k Summary

Exhibits

2.1* English Translation of Agreement on Support for Reorganization Companies with Nobuaki Kobayashi and Yukio Sakamoto, the trustees of Elpida Memory, Inc. and its wholly-owned subsidiary, Akita Elpida Memory, Inc. dated July 2, 2012 8-K/A 2.1 10/31/12 2.2* English Translation of Agreement Amending Agreement on Support for Reorganization Companies, dated October 29, 2012, by and among Micron Technology, Inc. and Nobuaki Kobayashi and Yukio Sakamoto, the trustees of Elpida Memory, Inc. and Akita Elpida Memory, Inc. 8-K 2.3 10/29/12 2.3* English Translation of Agreement Amending Agreement on Support for Reorganization Companies, dated July 31, 2013, by and among Micron Technology, Inc. and Nobuaki Kobayashi and Yukio Sakamoto, the trustees of Elpida Memory, Inc. and Akita Elpida Memory, Inc. 8-K 2.4 8/6/13 2.4 English Translation of the Reorganization Plan of Elpida Memory, Inc. 8-K 2.5 8/6/13 2.5 2016 Share Swap Agreement, dated February 3, 2016 by and among Micron Technology B.V., Micron Semiconductor Taiwan Co. Ltd. and Inotera Memories, Inc. 10-Q 3/3/16 2.6 4/8/16 3.1 Restated Certificate of Incorporation of the Registrant 8-K 99.2 1/26/15 3.2 Bylaws of the Registrant, Amended and Restated 8-K 99.1 4/15/14 4.1 Indenture dated as of April 18, 2012, by and between Micron Technology, Inc. and U.S. Bank National Association, as Trustee for 2.375% Convertible Senior Notes due 2032 8-K 4.1 4/18/12 4.2 Indenture dated as of April 18, 2012, by and between Micron Technology, Inc. and U.S. Bank National Association, as Trustee for 3.125% Convertible Senior Notes due 2032 8-K 4.3 4/18/12 4.3 Form of 2032C Note (included in Exhibit 4.1) 8-K 4.3 4/18/12 4.4 Form of 2032D Note (included in Exhibit 4.2) 8-K 4.3 4/18/12 4.5 Indenture dated July 26, 2011, by and between Micron Technology, Inc. and U.S. Bank National Association, as Trustee for 1.875% Convertible Senior Notes due 2031 8-K 4.3 7/26/11 4.6 Indenture, dated as of February 12, 2013, by and between Micron Technology, Inc. and U.S. Bank National Association, as trustee 8-K 4.1 2/12/13 4.7 Indenture, dated as of February 12, 2013, by and between Micron Technology, Inc. and U.S. Bank National Association, as trustee 8-K 4.3 2/12/13 4.8 Form of 2033E Note (included in Exhibit 4.6) 8-K 4.1 2/12/13 4.9 Form of 2033F Note (included in Exhibit 4.7) 8-K 4.3 2/12/13 4.10 Indenture, dated as of November 12, 2013, by and between Micron Technology, Inc. & U.S. Bank National Association 8-K 4.1 11/18/13 4.11 Form of New Note (included in Exhibit 4.10) 8-K 4.1 11/18/13 4.12 Indenture dated as of December 16, 2013, by and among Micron Semiconductor Asia Pte., Ltd., Wells Fargo Bank, National Association, and Export-Import Bank of the United States 10-Q 2/27/14 4.3 4/7/14 4.13 Indenture dated as of February 10, 2014, by and between Micron Technology, Inc. and U.S. Bank National Association, as Trustee 8-K 4.1 2/12/14 4.14 Form of Note (included in Exhibit 4.13) 8-K 4.1 2/12/14 4.15 Indenture, dated as of July 28, 2014, by and between Micron Technology, Inc. and U.S. Bank National Association, as Trustee 8-K 4.1 7/29/14 4.16 Form of Note (included in Exhibit 4.15) 8-K 4.1 7/29/14 4.17 Indenture, dated as of April30, 2015, by and between Micron Technology,Inc. and U.S. Bank National Association, as Trustee 8-K 4.1 4/30/15 4.18 Indenture, dated as of April30, 2015, by and between Micron Technology,Inc. and U.S. Bank National Association, as Trustee 8-K 4.2 4/30/15 4.19 Formof Note (included in Exhibit4.17) 8-K 4.1 4/30/15 4.20 Formof Note (included in Exhibit4.18) 8-K 4.2 4/30/15 4.21 Indenture, dated as of February 3, 2015, by and between Micron Technology, Inc. and U.S. Bank National Association, as Trustee 8-K 4.1 2/3/15 4.22 Form of Note (included in Exhibit 4.21) 8-K 4.1 2/3/15 4.23 Indenture, dated as of April 26, 2016, by and among Micron Technology, Inc., the subsidiary guarantors from the time to time party thereto and U.S. Bank National Association, as trustee and collateral agent 8-K 4.1 4/26/16 4.24 Form of Note (included in Exhibit 4.23) 8-K 4.1 4/26/16 4.25 Section 382 Rights Agreement, dated as of July 20, 2016 by and between Micron Technology, Inc. and Wells Fargo Bank, National Association, as rights agent 8-K 4.1 7/20/16 10.1 Executive Officer Performance Incentive Plan, as Amended DEF 14A C 12/12/14 10.2 1997 Nonstatutory Stock Option Plan, as Amended 10-K 8/30/12 10.5 10/29/12 10.3 1998 Nonstatutory Stock Option Plan, as Amended 10-K 8/30/12 10.7 10/29/12 10.4 2001 Stock Option Plan, as Amended 10-K 8/30/12 10.8 10/29/12 10.5 2001 Stock Option Plan Form of Agreement 8-K 99.2 4/6/05 10.6 2004 Equity Incentive Plan, as Amended and Restated 10-K 9/1/16 10.6 10/28/16 10.7 2004 Equity Incentive Plan Forms of Agreement and Terms and Conditions 10-K 9/1/16 10.7 10/28/16 10.8 Amended and Restated 2007 Equity Incentive Plan 10-K 9/1/16 10.8 10/28/16 10.9 2007 Equity Incentive Plan Forms of Agreement 10-K 9/1/16 10.9 10/28/16 10.10 Nonstatutory Stock Option Plan, as Amended 10-K 9/1/16 10.10 10/28/16 10.11 Nonstatutory Stock Option Plan Form of Agreement and Terms and Conditions 10-K 9/1/16 10.11 10/28/16 10.12 Numonyx Holdings B.V. Equity Incentive Plan S-8 4.1 6/16/10 10.13 Numonyx Holdings B.V. Equity Incentive Plan Forms of Agreement S-8 4.2 6/16/10 10.14* Patent License Agreement dated September 15, 2006, by and among Toshiba Corporation, Acclaim Innovations, LLC and Micron Technology, Inc. 10-Q 11/30/06 10.66 1/16/07 10.15 Form of Indemnification Agreement between the Registrant and its officers and directors 10-Q 2/27/14 10.3 4/7/14 10.16* Master Agreement dated as of November 18, 2005, between Micron Technology, Inc. and Intel Corporation 10-Q 12/1/05 10.155 1/10/06 10.17* Supply Agreement dated as of January 6, 2006, between Intel Corporation and IM Flash Technologies, LLC 10-Q 12/1/05 10.163 1/10/06 10.18 Form of Severance Agreement 8-K 99.2 11/1/07 10.19 Share Purchase Agreement by and among Micron Technology, Inc. as the Buyer Parent, Micron Semiconductor B.V., as the Buyer, Qimonda Ag as the Seller Parent and Qimonda Holding B.V., as the Seller Sub dated as of October11, 2008 10-Q 12/4/08 10.70 1/13/09 10.20* 2012 Master Agreement by and among Intel Corporation, Intel Technology Asia PTE LTD, Micron Technology, Inc., Micron Semiconductor Asia PTE LTD, IM Flash Technologies, LLC and IM Flash Singapore, LLP dated February 27, 2012 10-Q 3/1/12 10.104 4/9/12 10.21* Second Amended and Restated Limited Liability Company Operating Agreement of IM Flash Technologies, LLC dated April 6, 2012, between Micron Technology, Inc. and Intel Corporation 10-Q 5/31/12 10.108 7/9/12 10.22* Amendment to the Master Agreement dated April 6, 2012, between Intel Corporation and Micron Technology, Inc. 10-Q 5/31/12 10.109 7/9/12 10.23* Amended and Restated Supply Agreement dated April 6, 2012, between Intel Corporation and IM Flash Technologies, LLC 10-Q 5/31/12 10.110 7/9/12 10.24* Amended and Restated Supply Agreement dated April 6, 2012, between Micron Technology, Inc. and IM Flash Technologies, LLC 10-Q 5/31/12 10.111 7/9/12 10.25* Product Supply Agreement dated April 6, 2012, among Micron Technology, Inc., Intel Corporation and Micron Semiconductor Asia Pte. Ltd. 10-Q 5/31/12 10.112 7/9/12 10.26* Wafer Supply Agreement dated April 6, 2012, among Micron Technology, Inc., Intel Corporation and Micron Semiconductor Asia Pte. Ltd. 10-Q 5/31/12 10.113 7/9/12 10.27 Form of Capped Call Confirmation dated April 2012 8-K 10.1 4/18/12 10.28* Supply Agreement, dated January 17, 2013, by and among Micron Technology, Inc., Micron Semiconductor Asia Pte. Ltd. and Inotera Memories, Inc. 10-Q 2/28/13 10.122 4/8/13 10.29* Joint Venture Agreement, dated January 17, 2013, by and among Micron Semiconductor B.V., Numonyx Holdings B.V., Micron Technology Asia Pacific, Inc. and Nanya Technology Corporation 10-Q 2/28/13 10.123 4/8/13 10.30* Facilitation Agreement, dated January 17, 2013, by and among Micron Semiconductor B.V., Numonyx Holdings B.V., Micron Technology Asia Pacific, Inc., Nanya Technology Corporation and Inotera Memories, Inc. 10-Q 2/28/13 10.124 4/8/13 10.31 Micron Guaranty Agreement, dated January 17, 2013, by Micron Technology, Inc. in favor of Nanya Technology Corporation 10-Q 2/28/13 10.125 4/8/13 10.32* Technology Transfer and License Option Agreement for 20NM Process Node, dated January 17, 2013, by and between Micron Technology, Inc. and Nanya Technology Corporation 10-Q/A 2/28/13 10.126 8/7/13 10.33* Omnibus IP Agreement, dated January 17, 2013, by and between Nanya Technology Corporation and Micron Technology, Inc. 10-Q 2/28/13 10.127 4/8/13 10.34* Second Amended and Restated Technology Transfer and License Agreement for 68-50NM Process Nodes, dated January 17, 2013, by and between Micron Technology, Inc. and Nanya Technology Corporation 10-Q/A 2/28/13 10.128 8/7/13 10.35* Third Amended and Restated Technology Transfer and License Agreement, dated January 17, 2013, by and between Micron Technology, Inc. and Nanya Technology Corporation 10-Q 2/28/13 10.129 4/8/13 10.36* Omnibus IP Agreement, dated January 17, 2013, by and between Micron Technology, Inc. and Inotera Memories, Inc. 10-Q 2/28/13 10.130 4/8/13 10.37* English Translation of Front-End Manufacturing Supply Agreement, dated July 31, 2013, by and between Micron Semiconductor Asia Pte. Ltd. and Elpida Memory, Inc. 8-K/A 10.139 10/2/13 10.38* English Translation of Research and Development Engineering Services Agreement, dated July 31, 2013, by and between Micron Technology, Inc. and Elpida Memory, Inc. 8-K 10.140 8/6/13 10.39* English Translation of General Services Agreement, dated July 31, 2013, by and between Micron Semiconductor Asia Pte. Ltd. and Elpida Memory, Inc. 8-K/A 10.141 10/2/13 10.40 Form of Capped Call Confirmation dated February 2013 8-K 10.1 2/12/13 10.41 Purchase Agreement, dated as of February 5, 2014, by and among Micron Technology, Inc. and Morgan Stanley & Co. LLC, Goldman, Sachs & Co. and Credit Suisse Securities (USA) LLC, as representatives of the initial purchasers 8-K 10.1 2/7/14 10.42 Registration Rights Agreement, dated as of February 10, 2014, by and among Micron Technology, Inc. and Morgan Stanley & Co. LLC, Goldman, Sachs & Co. and Credit Suisse Securities (USA) LLC, as representatives of the initial purchasers 8-K 10.1 2/12/14 10.43 Purchase Agreement, dated as of July 23, 2014, by and among Micron Technology, Inc. and Morgan Stanley & Co LLC, Goldman, Sachs & Co. and Credit Suisse Securities (USA) LLC, as representatives of the initial purchasers 8-K 10.1 7/24/14 10.44 Registration Rights Agreement dated as of July 28, 2014, by and among Micron Technology, Inc. and Morgan Stanley & Co. LLC, Goldman, Sachs & Co. and Credit Suisse Securities (USA) LLC, as representatives of the initial purchasers 8-K 10.1 7/29/14 10.45 Credit Agreement dated as of December 2, 2014 among Micron Technology, Inc. and Micron Semiconductor Products, Inc., as Borrowers, HSBC Bank USA, N.A., as Administrative Agent, Co-Collateral Agent, Joint Lead Arranger and Joint Book Runner, and certain other financial institutions party thereto as additional agents and/or lenders 8-K 99.1 12/8/14 10.46 Facility Agreement, dated February 12, 2015, among Micron Semiconductor Asia Pte. Ltd., as borrower, certain financial institutions party thereto, and The Hongkong and Shanghai Banking Corporation Limited, as facility agent, security agent and account bank 10-Q 3/5/15 10.88 4/10/15 10.47* 2015 Supply Agreement, dated February 10, 2015, by and among Micron Technology, Inc., Micron Semiconductor Asia Pte. Ltd. and Inotera Memories, Inc. 10-Q 3/5/15 10.90 4/10/15 10.48* 2016 Supply Agreement, dated February 10, 2015, by and among Micron Technology, Inc., Micron Semiconductor Asia Pte. Ltd. and Inotera Memories, Inc. 10-Q 3/5/15 10.91 4/10/15 10.49* Second Amended and Restated Supply Agreement, dated February 10, 2017, by and among Micron Technology, Inc., Intel Corporation and Micron Semiconductor Asia Pte. Ltd. 10-Q 3/2/17 10.49 3/28/17 10.50* Amended and Restated Supplemental Wafer Supply Agreement, dated February 10, 2017, by and among Micron Technology, Inc., Intel Corporation and Micron Semiconductor Asia Pte. Ltd. 10-Q 3/2/17 10.50 3/28/17 10.51* Amended and Restated Wafer Supply Agreement No. 3 dated, February 10, 2017, by and among Micron Technology, Intel Corporation and Micron Semiconductor Asia Pte. Ltd. 10-Q 3/2/17 10.51 3/28/17 10.52* First Amendment to the Wafer Supply Agreement, dated September 1, 2015, by and among Micron Technology, Inc., Intel Corporation and Micron Semiconductor Asia Pte. Ltd. 10-K 9/3/15 10.54 10/27/15 10.53 Purchase Agreement, dated as of April27, 2015, by and among Micron Technology,Inc. and Morgan Stanley& Co. LLC, Goldman, Sachs& Co. and Credit Suisse Securities (USA) LLC, as representatives of the initial purchasers 8-K 10.1 4/30/15 10.54* 2016 Technology Transfer and License Option Agreement for 1X Process Node dated as of February 3, 2016 by and between Micron Technology, Inc. and Nanya Technology Corporation 10-Q/A 3/3/16 10.56 9/8/16 10.55* 2016 Technology Transfer and License Option Agreement for 1Y Process Node dated as of February 3, 2016 by and between Micron Technology, Inc. and Nanya Technology Corporation 10-Q/A 3/3/16 10.57 9/8/16 10.56 Form of Voting and Support Agreement by and among Micron Technology B.V., Micron Semiconductor Taiwan Co. Ltd., and Nanya Technology Corporation and certain of its affiliates 10-Q 3/3/16 10.58 4/8/16 10.57 2016 First Amendment to the Second Amended and Restated Operating Agreement dated January 5, 2016 by and among Micron Technology, Inc. and Intel Corporation 10-Q 3/3/16 10.59 4/8/16 10.58* Amendment to Technology Transfer and License Option Agreement for 1X Process Node dated as of May 17, 2016 by and between Micron Technology Inc. and Nanya Technology Corporation 10-Q 6/2/16 10.60 7/6/16 10.59* Amendment to Technology Transfer and License Option Agreement for 1Y Process Node dated as of May 17, 2016 by and between Micron Technology Inc. and Nanya Technology Corporation 10-Q 6/2/16 10.61 7/6/16 10.60 Security Agreement, dated as of April 26, 2016 made by Micron Technology, Inc. and certain subsidiaries in favor of U.S. Bank National Association, as collateral agent 8-K 10.1 4/26/16 10.61 Credit Agreement, dated as of April 26, 2016, by and among Micron Technology, Inc., as borrower, Morgan Stanley Senior Funding, Inc. as administrative agent and collateral agent, and the other agents party thereto and each financial institution party from time to time thereto 8-K 10.2 4/26/16 10.62 Guarantee and Collateral Agreement, dated as of April 26, 2016, made by Micron Technology, Inc. and certain of its subsidiaries in favor of Morgan Stanley Senior Funding, Inc., as collateral agent 8-K 10.3 4/26/16 10.63 English translation of Syndicated Loan Agreement dated October 11, 2016, as Amended on November 23, 2016 by and among Inotera Memories, Inc., Micron Semiconductor Taiwan Co., Ltd., certain financial institutions party thereto and Bank of Taiwan, as Facility Agent and Mega International Commercial Bank Co., Ltd., as Collateral Agent 10-Q 12/1/16 10.63 1/9/17 10.64 Deferred Compensation Plan 10-Q 3/2/17 10.64 3/28/17 10.65 First Amendment to the Credit Agreement, dated April 26, 2016, by and among Micron Technology, Inc., as borrower, Morgan Stanley Senior Funding, Inc. as administrative agent and collateral agent, and the other agents party thereto and each financial institution party from time to time thereto 10-Q 12/16/16 10.65 1/9/17 10.66 English translation of Facility Agreement dated November 18, 2016, by and among Micron Semiconductor Asia Capital II Pte. Ltd., certain financial institutions party thereto and DBS Bank Ltd., as Facility Agent, Security Agent and Account Bank 10-Q 12/16/16 10.66 1/9/17 10.67 Executive Agreement dated April 26, 2017 by and between Micron Technology, Inc. and Sanjay Mehrotra 10-Q 6/1/17 10.67 6/30/17 10.68 Second Amendment to the Credit Agreement, dated April 26, 2017, by and among Micron Technology, Inc., as borrower, Morgan Stanley Senior Funding, Inc. as administrative agent and collateral agent, and the other agents party thereto and each financial institution party from time to time thereto 10-Q 6/1/17 10.68 6/30/17 10.69 English translation of the Second Amendment to the Syndicated Loan Agreement, dated as of July 14, 2017 by and among Micron Technology Taiwan, Inc., Micron Semiconductor Taiwan, Co., Ltd., certain financial institutions party thereto and Bank of Taiwan, as Facility Agent and Mega International Commercial Bank Co., Ltd., as Collateral Agent 10.70 Executive Covenant Agreement dated June 23, 2017 by and between Micron Technology, Inc. and Sumit Sadana 10.71 Second Amendment to the Amended and Restated Severance Agreement effective July 24, 2017 by and between Micron Technology, Inc. and D. Mark Durcan 21.1 Subsidiaries of the Registrant 23.1 Consent of Independent Registered Public Accounting Firm 31.1 Rule 13a-14(a) Certification of Chief Executive Officer 31.2 Rule 13a-14(a) Certification of Chief Financial Officer 32.1 Certification of Chief Executive Officer Pursuant to 18 U.S.C. 1350 32.2 Certification of Chief Financial Officer Pursuant to 18 U.S.C. 1350